ECOREL FREE 305-WS12
Excellent wetting properties
- Sac305 lead free solder paste
- SMT printing process
- Excellent wetting properties
ECOREL FREE 305-WS12
Is a lead-free water-soluble solder paste especially designed for fine pitch SMT & semiconductor processes where post reflow flux removal is required. The formulation has been optimized to achieve excellent wetting and easy cleanability. The long stencil life and steady tackiness contributes to a stable process.
The chemistry of ECOREL FREE 305-WS12 is also available with other alloys and particle sizes on request.
FEATURES
| SPECIFICATIONS | ECOREL FREE 305-WS12 T4 | ECOREL FREE 305-WS12 T5 |
|---|---|---|
| Alloy | Sn96.5Ag3Cu0.5 | Sn96.5Ag3Cu0.5 |
| Melting point (°C/°F) | 217 / 422 | 217 / 422 |
| Metal content (%) | 89 ± 0.5 | 88 ± 0.5 |
| Post reflow residues | Approximately 5% by w/w | Approximately 5% by w/w |
| Halogen content | <0.5% halide | <0.5% halide |
| Powder size | 20 – 38 microns / Type 4 | 15 – 25 microns / Type 5 |
| Spiral pump* Viscosity (Pa.s 25°C) | Typical 300 | Typical 210 |
*The equipment used to test spiral pump viscosity is Malcom at a 10 rpm rotation speed.
CHARACTERISTICS
| CHARACTERISTICS | VALUES | METHOD |
|---|---|---|
| Flux Classification |
REH1 122 |
ANSI/J-STD-004 ISO 9454 |
| Solder balling test | Pass | ANSI/J-STD-005 |
| Copper mirror | H | ANSI/J-STD-004 |
| Copper corrosion | Major | ANSI/J-STD-004 |
| SIR (IPC) | Pass | ANSI/J-STD-004 |
| SIR after cleaning (Bellcore) | Pass | Bellcore |
| Electromigration (IPC / Bellcore) | Pass | ANSI/J-STD-004 / Bellcore |
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MAIN CONTRIBUTORS WHICH REDUCE IMPACT:
HUMAN HEALTH & SAFETY
- Lead-free alloy
- Non-toxic & no CMR containing substances
ENVIRONMENT PROTECTION & RESOURCES SAVINGS
- Low environmental impact: no H labelling regarding aquatic toxicity
- Made from recycled metals, reducing substantially carbon footprint.
- Water-cleanable formulation minimizes needs for cleaning chemicals
Benefits
PERFORMANCE
- High production throughput
- Very good wetting on all surface finishes, including OSP
- Excellent paste transfer volume
COST
- Good first pass yield testability in ICT
- Post soldering residues easily cleaned
HSE
- Lead free
- Free of CMR containing substances
- Greenway product
Process Recommendation
The best process will depend on factors such as operating conditions, equipment, board or component design.
Check our product datasheet for info on process recommendations.
Be assured, our team is ready to advise and assist you in the implementation of our products.
ECOREL FREE 305-WS12 is a water-based solder paste and requires cleaning after reflow.
Check out our cleaning solutions.
Check our product datasheet for info on process recommendations.
Be assured, our team is ready to advise and assist you in the implementation of our products.
ECOREL FREE 305-WS12 is a water-based solder paste and requires cleaning after reflow.
Check out our cleaning solutions.
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