ECOFREC TF48
Excellent printing high viscosity
- No clean tacky flux
- Flip Chip, spheres soldering & components rework
- Excellent printing & high viscosity
ECOFREC TF48
A halogen free, no-clean tacky flux designed for lead-free and leaded applications. After reflow, the residue is non-corrosive. Best in class for dispensing, dipping and especially for printing applications.
ECOFREC™ TF48 can be applied by dispensing, dipping, brush or stencil printing.
The tacky properties of ECOFREC™ TF48 ensure that components are kept in position until the alloy is reflowed. A variety of reflow methods may be used to produce the solder joint with ECOFREC™ TF48; these include soldering irons, hot gas and hot bar devices, IR or convection oven or vapour phase.
FEATURES
| SPECIFICATIONS | ECOFREC TF48 |
|---|---|
| Flux appearance | Amber |
| Density at 20°C (g/cm³) | 1 |
| Solubility in water | Not soluble |
| Solubility in alcohol | Soluble |
| Halogen content | No halogen |
|
Viscosity (Pa·s at 20°C) (Brookfield RVT TF at 5 RPM) |
350 – 550 |
CHARACTERISTICS
| STANDARDS TESTS | RESULTS | PROCEDURES |
|---|---|---|
| Flux classification | ROL0 | ANSI/J-STD-004 |
| SIR / Electromigration (IPC) | Pass | ANSI/J-STD-004 |
|
Bono corrosion test 85°C / 85% RH – 15 days |
Pass: Fc < 1% | Inventec MO.SB.10029 |
| Chromate paper | Pass | ANSI/J-STD-004 |
| Copper mirror | Pass | ANSI/J-STD-004 |
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PERFORMANCE
- High viscosity tacky flux to keep components firm in place
- Non corrosive residues
COST
- Stable process as great reproducible volumes of flux are applied
- no flux residues cleaning required
HSE
- No CMR substances
- Free of halide (Fluoride, Chloride, Bromide) and amine
- RoHS & REACH compliant
Process Recommendation
The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. In any case, our team is ready to advise and assist you in the implementation of our products.
