ECOFREC 77
For soldering with lead-free metals
- Water based no-clean liquid flux
- Lead free tinning process by dipping
- Low residue
ECOFREC 77
A low residue, no-clean, VOC (Volatile Organic Compound) free flux especially designed for tinning process with lead free alloys. It provides excellent soldering performance, especially in a dipping process. PCB cleaning after soldering is not necessary due to its very low solids content.
ECOFREC 77 is recommended for lead free soldering with alloys as SnAgCu, SnCu, pure Sn.
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PERFORMANCE
- Low residue, no clean
- Excellent soldering performance
COST
- Avoid possible VOC taxes
- No cleaning required
HSE
- No CMR substances
- 100% VOC free
- Free of halide (Fluoride, Chloride, Bromide) and amine
- Non flammable
Process Recommendation
The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. In any case, our team is ready to advise and assist you in the implementation of our products.