AMTECH NC-559-V2-LF-TF
No clean Tacky flux for professionals
- No clean tacky flux
- Lead-Free soldering
- Excellent wetting properties
AMTECH NC-559-V2-LF-TF
Is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. AMTECH NC-559-V2-LF-TF may be used for BGA sphere attachment and reballing. AMTECH NC-559-V2-LF-TF is also designed to work on all flip chip bumping and chip scale packaging sites.
TEST RESULTS
| TEST J-STD-004 OR OTHER REQUIREMENTS (AS STATED) | TEST REQUIREMENT | RESULT |
|---|---|---|
| Copper Mirror | IPC-TM-650: 2.3.32 | L: No breakthrough |
| Corrosion | IPC-TM-650: 2.6.15 | L: No corrosion |
| Quantitative Halides | IPC-TM-650: 2.3.28.1 | L: <0.5% |
| Electrochemical Migration | IPC-TM-650: 2.6.14.1 | L: <1 decade drop (no clean) |
|
Surface Insulation Resistance 85°C, 85% RH @ 168 Hours |
IPC-TM-650: 2.6.3.7 | L: 100 MΩ (No-clean) |
|
Viscosity Malcom @ 10 RPM / 25°C (x10³ mPa/s) |
IPC-TM-650: 2.4.34.4 | 40–52 |
| Visual | IPC-TM-650: 3.4.2.5 | Clear and free from precipitation |
| Conflict Minerals Compliance | Electronic Industry Citizenship Coalition (EICC) | Compliant |
| REACH Compliance | Articles 33 and 67 of regulation (EC) No 1907/2006 | May contain up to 1% w/w of ethoxylated 4-nonylphenol |
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Hide linksBenefits
- REL0 flux classification
- Wide process window
- Excellent wetting compatibility on most board finishes
- Clear residue
- High temperature compatible