AMTECH 4300/LF4300-TF
Tacky flux for professionals
- No clean tacky flux
- Leaded/lead-free soldering
- Excellent wetting properties
AMTECH LF-4300-TF
Is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. AMTECH LF-4300-TF may be used for BGA sphere attachment and reballing. AMTECH 4300/LF-4300-TF may be used for BGA sphere attachment and reballing. This tacky flux is also designed to work on all flip chip bumping and chip scale packaging sites.
COMPATIBLE ALLOYS
| ALLOY | TEMPERATURE °C | TEMPERATURE °F |
|---|---|---|
| 63Sn/37Pb | 183 | 361 |
| 62Sn/36Pb/2Ag | 179 | 354 |
| 42Sn/58Bi | 138 | 280 |
| 96.5Sn/3.0Ag/0.5Cu | 217-220 | 423-428 |
| 99.0Sn/0.3Ag/0.7Cu | 217-221 | 423-430 |
| 96.5Sn/3.5Ag | 221 | 430 |
| 95Sn/5Sb | 235-240 | 455-464 |
| 95Sn/5Ag | 221-245 | 430-473 |
TEST RESULTS
| TEST J-STD-004 OR OTHER REQUIREMENTS (AS STATED) | TEST REQUIREMENT | RESULT |
|---|---|---|
| Copper Mirror | IPC-TM-650: 2.3.32 | L: No breakthrough |
| Corrosion | IPC-TM-650: 2.6.15 | L: No corrosion |
| Quantitative Halides | IPC-TM-650: 2.3.28.1 | L: <0.5% |
| Electrochemical Migration | IPC-TM-650: 2.6.14.1 | L: <1 decade drop (no clean) |
|
Surface Insulation Resistance 85°C, 85% RH @ 168 Hours |
IPC-TM-650: 2.6.3.3 | L: 100 M (no clean) |
|
Viscosity Malcom @ 10 RPM/25°C (x10³ mPa/s) |
IPC-TM-650: 2.4.34.4 | 20–48 |
| Visual | IPC-TM-650: 3.4.2.5 | Clear and free from precipitation |
| Conflict Minerals Compliance | Electronic Industry Citizenship Coalition (EICC) | Compliant |
| REACH Compliance | Articles 33 and 67 of regulation (EC) No 1907/2006 | Contains no substance >0.1% w/w that is listed as a SVHC or restricted for use in solder materials |
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Hide linksBenefits
- REL0 flux classification
- Wide process window
- Excellent wetting compatibility on most board finishes
- Low voiding, including LGA
- REACH compliant
- Optimized for lead-free and standard allow systems