ECOREL EASY 803M
Low residue no-clean solder paste
- Sn63Pb37 leaded solder paste
- No clean SMT printing process
- Robust assembly.
ECOREL EASY 803M
Offers a good balance between wettability, printing capability and ability to withstand various thermal profiles. It exhibits high printing speed, excellent abandon time and long steady tackiness.
Lead containing alloys are perfect to withstand constant high temperature fluctuations (-40 to >130 Celcius). However, leaded solder pasted are limited in their use due to the environmental impact of lead. Exceptions are made for Automotive, Aerospace and Defence electronics.
INVENTEC can help you to propose a lead free alternative based on your specific application.
FEATURES
| SPECIFICATIONS | Ecorel™ Easy 803M | Ecorel™ Easy 803M T4 |
|---|---|---|
| Alloy | Sn63Pb37 | Sn63Pb37 |
| Powder size distribution (microns) | 25–45 | 20–38 |
| Melting point (°C) | 183 | 183 |
| Metal content (%) | 89.5 ± 0.5 | 89.5 ± 0.5 |
| Residue after reflow soldering (%) | 47 – 54 | 47 – 54 |
| Halogen content | No halogen | No halogen |
| Viscosity* (Pa.s at 20°C) * Brookfield RVT, TF at 5 RPM |
900 – 1100 | 900 – 1100 |
CHARACTERISTICS
| FUNCTIONAL TESTS | RESULTS | PROCEDURES |
|---|---|---|
| Flux classification |
L 0 F-SW 32 113 |
ANSI/J-STD-004 DIN 8511 ISO 9454 |
| Solderballing test | Class 1 | ANSI/J-STD-004 |
| Copper mirror | Pass | ANSI/J-STD-004 |
| Copper corrosion | Pass | ANSI/J-STD-004 |
|
S.I.R. (Ohms) After 21 days 85°C – 85% RH – 50 Volts End of cycle 20°C – 65% RH |
Pass
> 109 > 1010 |
ANSI/J-STD-004 |
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PERFORMANCE
- Excellent printing accuracy and great paste deposit results
- Very good wetting on all surface finishes, including OSP
- Transparent colorless residue, even after multiple reflow cycles
- Withstands high thermal profiles
COST
- Possibility of extended print-runs to minimizing machine downtime
- Flux residues can be potentially left on assembly as being non-corrosive
HSE
- No Halogen
- No CMR containing substances in flux media.
Process Recommendation
The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. Be assured, our team is ready to advise and assist you in the implementation of our products.