AMTECH NC-559-V3

AMTECH NC-559-V3

Tacky flux for professionals

  • No clean tacky flux
  • Leaded/ Lead-free soldering
  • Excellent wetting & transparent residues
AMTECH NC-559-V3

This is the 3th generation of the famous NC-559 tacky flux. Developed to achieve even better wetting and a more clear transparent residue. It is formulated for syringe application, stencil printing and rework processes on all PCB surface finishes. AMTECH NC-559-V3 performs excellent for BGA sphere attachment and reballing. It is also designed to work on all flip chip bumping and chip scale packaging sites.

COMPATIBLE ALLOYS
ALLOY TEMPERATURE °C TEMPERATURE °F
63Sn/37Pb 183 361
62Sn/36Pb/2Ag 179 354
62.8Sn/36.8Pb/0.4Ag 179–183 354–361
60Sn/40Pb 183–191 361–376
43Sn/43Pb/14Bi 144–163 291–325
42Sn/58Bi 138 280
10Sn/88Pb/2Ag 268–290 514–554

TEST RESULTS
TEST J-STD-004 OR OTHER REQUIREMENTS (AS STATED) TEST REQUIREMENT RESULT
Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough
Corrosion IPC-TM-650: 2.6.15 L: No corrosion
Quantitative Halides IPC-TM-650: 2.3.28.1 L: No halogen
Electrochemical Migration IPC-TM-650: 2.6.14.1 L: <1 decade drop (no-clean)
Viscosity – Brookfield/20°C
Mobile F HELIPATH system, at 5 rpm
IPC-TM-650: 2.4.34.4 Typical 400
Visual IPC-TM-650: 3.4.2.5 Clear and free from precipitation
Conflict Minerals Compliance Electronic Industry Citizenship Coalition (EICC) Compliant
REACH Compliance Articles 33 and 67 of Regulation (EC) No 1907/2006 May contain up to 7% w/w of ethoxylated 4-nonylphenol

Benefits

PERFORMANCE

  • Excellent wetting compatibility on most board finishes
  • Wide process window
  • High temperature compatible
  • Clear residue

HSE

  • ROL0 flux classification
  • RoHS & REACH compliant

Process Recommendation

The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. In any case, our team is ready to advise and assist you in the implementation of our products.