Our advanced solder flux repair solutions are designed to deliver precise, reliable solder repair performance with superior wetting, strong joint integrity, and consistent electrical connectivity—ideal for high-precision rework soldering and complex component repair applications.
Effective electronics servicing relies heavily on high-quality repair solutions, especially during complex rework soldering processes. When tackling intricate packages like BGAs (Ball Grid Arrays) and QFNs (Quad Flat No-leads), having the right solder flux is critical to achieving reliable and durable solder repair outcomes.
A cornerstone of professional solder repair practices, tacky fluxes are widely used in advanced solder flux repair solutions. These fluxes provide strong surface adhesion, preventing components from shifting during the delicate rework soldering process. This stability is essential when working with tight pitch components, where precision is non-negotiable.
Tacky solder flux also plays a dual role—cleaning oxidation from contact points and enhancing solder wetting, which collectively ensure stronger electrical connections. Meanwhile, liquid fluxes are favored for their ability to evenly coat larger areas. This makes them particularly effective in solder repair tasks involving high-density components, where uniform solder flow is key.
Choosing the appropriate solder flux repair solutions for each component type allows technicians to optimize the quality and reliability of every rework soldering job. Whether it’s restoring damaged joints or replacing surface-mounted parts, tailored repair solutions can significantly extend the service life of electronic assemblies.
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Inventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.
Depending on your request, we provide online or onsite support
Do you need cleaning or coating after soldering? We provide FREE-OF-CHARGE cleaning or coating trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. It is also possible to attend trials in person.