Advancements in low temperature solder paste solutions are enabling more energy-efficient, reliable, and design-flexible electronics manufacturing by reducing reflow temperatures, minimizing PCB warpage, and supporting sustainable production practices.
Low temperature solder paste is transforming SMT assembly by offering a more energy-efficient, cost-effective, and environmentally responsible alternative to traditional high-temperature soldering processes.
INVENTEC’s low melt solder pastes allow for reliable soldering at significantly reduced reflow temperatures—ideal for heat-sensitive components and complex multi-layer PCBs. These formulations minimize thermal stress, reduce PCB warping, and support compact design layouts through simplified process steps like single-pass reflow.
In addition to technical performance, these low temp solder paste solutions help manufacturers lower their carbon footprint by cutting energy consumption and CO₂ emissions—meeting today’s sustainability goals without compromising on solder joint quality or reliability.
INVENTEC’s low temperature solder pastes are designed to meet modern demands for greener, more efficient, and thermally optimized electronics manufacturing.
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Low temperature solder pastes are specially formulated alloys designed to melt at temperatures significantly lower than traditional solder pastes, typically below 200°C. These pastes help reduce thermal stress on sensitive components and substrates during the soldering process.
Low temperature solder pastes minimize heat exposure, protecting temperature-sensitive components like plastics, LEDs, and certain semiconductors. They also enable soldering on substrates that can’t withstand high temperatures, improving overall assembly reliability.
Typical alloys include bismuth-tin (Sn-Bi), indium-based, or tin-silver-bismuth blends, which melt at temperatures ranging from 138°C to 190°C. These alloys provide good wetting and mechanical strength suitable for various industrial uses.
Reflow profiles for low temperature pastes require lower peak temperatures and carefully controlled ramp rates to avoid premature melting or poor joint formation. Always follow the solder paste manufacturer’s recommended profiles for optimal results.
Yes. Low temperature solder pastes can be used with existing stencil printers, jet printers, and reflow ovens, although reflow oven settings must be adjusted for the lower melting points. INVENTEC Performance Chemicals offers low temperature formulations optimized for standard industrial processes.
Industries such as consumer electronics, medical devices, automotive, and LED manufacturing benefit from low temperature solder pastes, especially when assembling heat-sensitive components or substrates.
When properly applied and reflowed, low temperature solder pastes form strong, durable solder joints with good mechanical and electrical properties, suitable for most industrial applications requiring reduced thermal exposure.
Yes, many low temperature solder pastes are formulated as lead-free alloys compliant with RoHS standards. INVENTEC Performance Chemicals offers lead-free low temperature solder pastes that balance environmental compliance with performance.
Low temperature solder pastes should be stored refrigerated (typically 0-10°C) to maintain their chemical properties and prevent premature curing. Proper handling ensures consistent printability and solder joint quality.
Inventec has a worldwide dedicated Technical Support team to help you along the different stages of our cooperation.
Depending on your request, we provide online or onsite support
Do you need cleaning or coating after soldering? We provide FREE-OF-CHARGE cleaning or coating trials in our Technical Centers. A comprehensive technical report detailing all test results and recommendations regarding process & process parameters will be provided. It is also possible to attend trials in person.