THERMASOLV DC2
Dielectric Fluids for chip cooling application
- Dielectric heat transfer fluid
- Boiling point: 26°C/79°F
- Liquid at ambient temperature
THERMASOLV DC2
Is dielectric heat transfer fluid, dedicated for direct to chip cooling applications. The favorable characteristics of the product’s viscosity, density and surface tension allows optimal surface contact, which contributes to a superior heat transfer performance.
THERMASOLV DC2 is specially formulated with an optimal boiling point of 26 °C (79 °F), allowing it to remain liquid at ambient temperatures for easier handling and filling, while still delivering highly efficient two-phase cooling.
It is compatible with all metals and alloys, including very sensitive ones. It has also good compatibility with most plastics & elastomers, however we recommend to test before use.
This product is formulated with safety in mind, resulting in a product that has no mentioning of any EUH-phrases, is non-flammable and no flash point. It is also a great sustainable solution as it has no ODP, ultra-low GWP and can be offered for recycling when needed.
| SPECIFICATIONS | VALUES | METHODS |
|---|---|---|
| Aspect | Colorless, clear | Visual |
| Purity (%) | >99,5 | BRY-MO-121 |
| CHARACTERISTICS | VALUES |
|---|---|
| Flash point | No |
| Boiling point | 26°C / 79°F |
| Pour Point | -103°C / -153°F |
| Critical Temperature | n.a |
| Critical Pressure (mPa) | n.a. |
| Surface tension (dynes/cm2) | 13 |
| Kinematic Viscosity (cSt) | 0.4 |
| Liquid density (Kg/m3 @ 20°C) | 1346 |
| Vapor pressure (kPa @20°C) | >70 |
| Dielectric Constant @1 kHz | under evaluation |
| Thermal conductivity (W/m-K) | 0.086 |
| Heat Vaporization | 163 J.g-1 |
| Specific heat Capacity (@20°C) | 1210 J kg-1 K-1 |
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MAIN CONTRIBUTORS WHICH REDUCE IMPACT:
HUMAN HEALTH & SAFETY
- Non-flammable, no flashpoint & no EUH risk phrases: 100% safe for storage and when used in equipment
- Non-toxic, no corrosive impact & no S risk phrases
ENVIRONMENT PROTECTION & RESOURCES SAVINGS
- No environmental hazard: no H labelling regarding environment
- Can be returned for recycling and re-use: ECOPROGRAM
- Ultra-low GWP
Benefits
Performance
- Thermally and chemically stable in use
- Very low surface tension
- Excellent thermal performance
Cost
- Can be returned for recycling and re-use
- Allow processors to run at lower temperatures, extending lifetime
HSE
- Ultra-low GWP & no ODP
- Non-flammable & no flashpoint
- Low environmental impact: GREENWAY product
Process information
Processes
The best process will depend on factors such as operating conditions & equipment. Our team is ready to advise you.
Although this product has very good compatibility properties, we cannot foresee all materials that could be exposed to the fluid. We strongly recommend testing before use.
The product can be used in the following processes:
- Direct to Chip application
- 2-phase immersion
- Specific manufacturing processes which need stable and uniform cooling
Temperature limits
2-phase system
- 2-phase system: Boiling Point: 26°C/79°F
Related products & services
ECOPROGRAM
