ECOREL SINTEC AP92
Low Pressure Sintering Process
- Low pressure AG sintering paste
- Printing application
- For die attach
ECOREL SINTEC AP92
Is low-pressure sintering paste for stencil or screen printing-process with silver as its main component. It has been developed for Si, SiC and GaN die attach through sintering process and ensure optimal wetting performance on DCB and AMB materials, gold, silver, copper and some nickel finishes.
It is suitable for sintering dies from 0.5×0.5 mm up to 20x20mm
Based on Nano-Join technology, ECOREL SINTEC AP92 exhibits superior levels of thermal conductivity and shear strength. Typical applications are found in the field of high-power die-attach, RF devices and power-LED.
Our sintering pastes does not contain halogen nor nanoparticles and can be stored at room temperature without affecting the workability.
| CHARACTERISTICS | VALUES |
|---|---|
| Metal | Ag + binders |
| Sintering temperature | Typically 220 to 250°C |
| Silver content after sintering | 100% |
| PERFORMANCE | VALUES |
|---|---|
| Shear strength | 40 to 90 MPa |
| Heat conductivity | >300 W/mK |
| Electric conductivity | 40 MS/m |
*Depending on applied sintering pressure (2-25 MPa)
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PERFORMANCE
- Stable over long print-runs without degradation, keeping accurate printing performance
- High thermal conductivity to offer great heat dissipation
- Higher silver content without agglomeration risk
- Very good wetting on all surface finishes
- High shear strength for improved reliability
- 100% silver content post-sintering
- TCT -55°C-+ 125°C >1000 cycles
- Excellent compatibility with hard and soft tool
COST
- Increase lifetime and reliability of your product, hence reduces risk of premature failures
- Room temperature storage
- Faster process with optimized BLT result
HSE
- Lead free
- No CMR containing substances
- No halogen
- No nanoparticles
- REACH & RoHS compliant