ECOREL FREE JP42
Jet printing equipment solder paste
- Sn42Bi57Ag1 solder paste
- Jet printing process
- Reduced Reflow Peak
ECOREL FREE JP42
Is low-melting point, lead-free solder paste especially designed to work on jet printing equipment and to guarantee continuous and consistent deposits of solder paste. Although the flux is chemical inert, it is easy to clean with water or solvent based processes. It is optimized to be used on Mycronic, Vermes, Musashi and Essemtec jet printing equipment.
Not only is this product ideal to solder temperature-sensitive components but it also reduces the energy needs of your process.
Standard jet printing options
| SPECIFICATIONS | ECOREL FREE JP42 85.0T6 |
|---|---|
| Alloy | Sn42Bi57Ag1 |
| Melting point (°C/°F) | 139-140°C / 282-284°F |
| Metal content (%) | 85 |
| Post reflow residues | Approximately 5% by w/w |
| Halogen content | No Halogen |
| Powder size | 5–15 microns / Type 6 |
| Spiral pump* Viscosity (Pa.s 25°C) | 70-130** |
| Syringe | EFD |
| Dedicated for equipment | Vermes, Essemtec, Musashi |
*The equipment used to test spiral pump viscosity is Malcom at a 10 rpm rotation speed.
**Slight adjustments in viscosity possible after finalizing full industrialization test procedure.
| CHARACTERISTICS | VALUES | TEST METHOD |
|---|---|---|
| Flux Classification |
ROL0 113 |
ANSI/J-STD-004 ISO 9454 |
| Solder balling test | Pass | ANSI/J-STD-005 |
| Copper mirror | Pass | ANSI/J-STD-004 |
| Copper corrosion | Pass | ANSI/J-STD-004 |
| SIR (IPC) | Pass | ANSI/J-STD-004 |
| SIR (Bellcore) | Pass | Bellcore |
| Electromigration (IPC / Bellcore) | Pass | ANSI/J-STD-004 / Bellcore |
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MAIN CONTRIBUTORS WHICH REDUCE IMPACT:
HUMAN HEALTH & SAFETY
- Lead free alloy
- Non-toxic & Low corrosive impact
ENVIRONMENT PROTECTION & RESOURCES SAVINGS
- Low environmental impact: no H labelling regarding aquatic toxicity
- Medium melting-point alloy -> saving energy
Benefits
Performance
- Excellent continuous & consistent paste deposits
- Chemical inert flux residue reducing risk of electrochemical migration & corrosion
- Easy to clean reflowed flux residues
- Ideal for soldering temperature-sensitive components
- Reduced component and PCB warpage risk
COST
- Minimizes line-down time & the need for re-work
- Increase lifetime and reliability of your product, hence reduces risk of premature failures
- Reduced reflow peak temperature, saving energy
HSE
- Lead free
- No halogen
- Free of CMR containing substances