ECOREL FREE JP42
Jet printing equipment solder paste
- Sn42Bi57Ag1 solder paste
- Jet printing process
- Reduced Reflow Peak
ECOREL FREE JP42
Is low-melting point, lead-free solder paste especially designed to work on jet printing equipment and to guarantee continuous and consistent deposits of solder paste. Although the flux is chemical inert, it is easy to clean with water or solvent based processes. It is optimized to be used on Mycronic, Vermes, Musashi and Essemtec jet printing equipment.
Not only is this product ideal to solder temperature-sensitive components but it also reduces the energy needs of your process.
Standard jet printing options
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MAIN CONTRIBUTORS WHICH REDUCE IMPACT:
HUMAN HEALTH & SAFETY
- Lead free alloy
- Non-toxic & Low corrosive impact
ENVIRONMENT PROTECTION & RESOURCES SAVINGS
- Low environmental impact: no H labelling regarding aquatic toxicity
- Medium melting-point alloy -> saving energy
Benefits
Performance
- Excellent continuous & consistent paste deposits
- Chemical inert flux residue reducing risk of electrochemical migration & corrosion
- Easy to clean reflowed flux residues
- Ideal for soldering temperature-sensitive components
- Reduced component and PCB warpage risk
COST
- Minimizes line-down time & the need for re-work
- Increase lifetime and reliability of your product, hence reduces risk of premature failures
- Reduced reflow peak temperature, saving energy
HSE
- Lead free
- No halogen
- Free of CMR containing substances
Process Recommendation
The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. Be assured, our team is ready to advise and assist you in the implementation of our products.