ECOREL FREE 405Y-21
Great thermal cycling performance
- SAC405 solder paste
- No clean SMT printing process
- Great thermal cycling performance
ECOREL FREE 405Y-21
Is a no-clean solder paste developed with the reliable chemistry of the ECOREL range, helping to assure a robust assembly process. The paste is suitable for reflow in convection ovens (nitrogen recommended), vapor phase or conduction ovens.
The alloy used in ECOREL FREE 405Y-21, contains some dopants which participate to the reinforcement of the interdendritic zone by a finer dispersion of precipitates, to ensure a better resistance to thermocycling for higher operating temperatures (more than 130°C/266°F ).
| SPECIFICATIONS | ECOREL FREE 405Y-21 |
|---|---|
| Alloy | Sn95,5Ag4Cu0,5 |
| Melting point (°C/°F) | 217°C / 422°F |
| Metal content (%) | 88.5 ± 0.5 |
| Post reflow residues | Approximately 5% by w/w |
| Halogen content | No Halogen |
| Powder size | 20–38 microns / Type 4 |
| Spiral pump* Viscosity (Pa.s 25°C) | Typical 165 |
*The equipment used to test spiral pump viscosity is Malcom at a 10 rpm rotation speed.
| CHARACTERISTICS | VALUES | TEST METHOD |
|---|---|---|
| Flux Classification | ROL0 | ANSI/J-STD-004 |
| Flux Classification | 113 | ISO 9454 |
| Solder balling test | Pass | ANSI/J-STD-005 |
| Copper mirror | Pass | ANSI/J-STD-004 |
| Copper corrosion | Pass | ANSI/J-STD-004 |
| SIR (IPC) | Pass | ANSI/J-STD-004 |
| SIR (Bellcore) | Pass | Bellcore |
| Electromigration (IPC / Bellcore) | Pass | ANSI/J-STD-004 / Bellcore |
| Bonotest (85°C / 85% HR – 15 days) | Pass – FC = 1.4% | INVENTEC BRY-MO-058 |
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Although fully in line with safety & environmental regulations, this product doesn`t match our strict criteria to be labelled as a Greenway product.
LOOKING FOR A MORE SUSTAINABLE SOLUTION?
GREENWAY ALTERNATIVE
- We currently don`t have a Greenway alternative but our target is to develop one in the near future. In case you want us to prioritize the development of a Greenway alternative, do not hesitate to contact us.
Benefits
PERFORMANCE
- Robust assembly for a stable process
- Low residue spreading
- Improved thermal cycling performance compared to SAC305
COST
- Minimizes line-down time & the need for re-work
- Maximizes throughput
HSE
- Lead free
- No halogen
- Free of CMR containing substances