ECOREL FREE 305-16

ECOREL FREE 305-16

Lead free solder paste for high production volumes

  • Sac305 lead free alloy solder paste
  • No clean smt printing process
  • Robust Assembly
ECOREL FREE 305-16

Especially designed to cater high volume electronics providing an overall balanced performance to guarantee a stable assembly process.

It’s a No Clean solder paste, combining the metallurgical properties of a SAC305 alloy with the high performance chemistry of the ECOREL™ range.

This solder paste has excellent visual solder joint cosmetics with transparent residues, even after multiple reflow cycles. Combining high first pass yield testability in ICT together with very good wetting abilities within different board finishes, including OSP.

FEATURES

SPECIFICATIONS ECOREL FREE 305-16 T3 ECOREL FREE 305-16 T4
Alloy Sn96,5Ag3Cu0,5 Sn96,5Ag3Cu0,5
Melting point (°C/°F) 217 / 422 217 / 422
Metal content (%) 88 88
Post reflow residues Approximately 5% by w/w Approximately 5% by w/w
Halogen content No Halogen No Halogen
Powder size 25 – 45 microns / Type 3 20 – 38 microns / Type 4
Spiral pump* Viscosity (Pa.s 25°C) Typical 160 Typical 165

*The equipment used to test spiral pump viscosity is Malcom at a 10 rpm rotation speed.

CHARACTERISTICS
CHARACTERISTICS VALUES METHOD
Flux Classification ROL0 ANSI/J-STD-004
Flux Classification 113 ISO 9454
Solder balling test Pass ANSI/J-STD-005
Copper mirror Pass ANSI/J-STD-004
Copper corrosion Pass ANSI/J-STD-004
SIR (IPC) Pass ANSI/J-STD-004
SIR (Bellcore) Pass Bellcore
Electromigration (IPC / Bellcore) Pass ANSI/J-STD-004 / Bellcore
Oxygen bomb test Pass EN14582

This is not a product

Although fully in line with safety & environmental regulations, this product doesn`t match our strict criteria to be labelled as a Greenway product.

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GREENWAY ALTERNATIVE

  • We currently don’t have a Greenway alternative but our target is to develop one in the near future. In case you want us to prioritize the development of a Greenway alternative, do not hesitate to contact us.
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Benefits

PERFORMANCE

  • Robust assembly for a stable process
  • Very good wetting on all surface finishes, including OSP
  • Transparent colorless residue, even after multiple reflow cycles

COST

  • Good first pass yield testability in ICT

HSE

  • Lead free
  • Halogen free
  • Free of CMR containing substances

Process Recommendation

The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. Be assured, our team is ready to advise and assist you in the implementation of our products.