ECOREL FREE 105-16

ECOREL FREE 105-16

Optimized for high-volume electronics with balanced solder paste for stable assembly

  • SAC105 lead free alloy solder paste
  • No clean SMT printing process
  • Robust Assembly Process
ECOREL FREE 105-16

Is a low-silver SAC105 solder paste especially designed to cater high volume electronics with an overall balanced solder paste performance to guarantee a stable assembly process. It’s a No Clean solder paste combining the metallurgical properties of SAC 305 alloy with high performance chemistry of the ECOREL™range.

This solder paste has excellent visual solder joint cosmetics with transparent residues, even after multiple reflow cycles. Combining high first pass yield testability in ICT together with very good wetting abilities within different board finishes, including OSP.

FEATURES
SPECIFICATIONS ECOREL FREE 105-16
Alloy SnAg1Cu0.5N
Melting point (°C/°F) 217–227
Metal content (%) 88.0 ± 0.5
Post reflow residues Approximately 5% by w/w
Halogen content No Halogen
Powder size 25–45 microns / Type 3
Spiral pump* Viscosity (Pa.s 25°C) Typical 160

*The equipment used to test spiral pump viscosity is Malcom at a 10 rpm rotation speed.

CHARACTERISTICS
CHARACTERISTICS VALUES METHOD
Flux Classification ROL0
113
ANSI/J-STD-004
ISO 9454
Solder balling test Pass ANSI/J-STD-005
Copper mirror Pass ANSI/J-STD-004
Copper corrosion Pass ANSI/J-STD-004
Chromate paper Pass ANSI/J-STD-004
SIR (IPC) Pass ANSI/J-STD-004
SIR (Bellcore) Pass Bellcore
Electromigration (IPC / Bellcore) Pass ANSI/J-STD-004 / Bellcore
Oxygen bomb test Pass EN 14582

This is not a product

Although fully in line with safety & environmental regulations, this product doesn`t match our strict criteria to be labelled as a Greenway product.

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GREENWAY ALTERNATIVE

  • We currently don’t have a Greenway alternative but our target is to develop one in the near future. In case you want us to prioritize the development of a Greenway alternative, do not hesitate to contact us.
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Benefits

PERFORMANCE

  • Robust assembly for a stable process
  • Very good wetting on all surface finishes, including OSP
  • Transparent colorless residue, even after multiple reflow cycles
  • Stable performance up to 31 days when stored at room temperature (30°C max)

COST

  • Good first pass yield testability in ICT
  • Cost-saving through reduced silver-content

HSE

  • No CMR containing substances
  • Lead Free & No Halogen

Process Recommendation

The best process will depend on factors such as operating conditions, equipment, board or component design. Our team is ready to advise you.