ECOREL EASY SPA-15
Best performance on printing accuracy
- SnPbAg leaded solder paste
- No clean SMT printing process
- Excellent performance for ultrafine-pitch
ECOREL EASY SPA-15
Is a SnPb36Ag2 no-clean solder paste in type 5 powder size, especially designed to achieve best performance on printing accuracy with ultrafine-pitch assembly processes.
FEATURES
| SPECIFICATIONS | ECOREL EASY SPA 15-T5 |
|---|---|
| Alloy | Sn62Pb36Ag2 |
| Melting point (°C/°F) | 178 / 383 |
| Metal content (%) | 89 +/- 0.5 |
| Post reflow residues | Approximately 5% by w/w |
| Halogen content | No Halogen |
| Powder size | 15–25 microns / Type 5 |
| Spiral pump* Viscosity (Pa.s 25°C) | Typical 135 |
*The equipment used to test spiral pump viscosity is Malcom at a 10 rpm rotation speed.
CHARACTERISTICS
| CHARACTERISTICS | VALUES | TEST METHOD |
|---|---|---|
| Flux Classification | ROL0 113 |
ANSI/J-STD-004 ISO 9454 |
| Solder balling test | Pass | ANSI/J-STD-005 |
| Copper mirror | Pass | ANSI/J-STD-004 |
| Copper corrosion | Pass | ANSI/J-STD-004 |
| SIR (IPC) | Pass | ANSI/J-STD-004 |
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PERFORMANCE
- Excellent printing accuracy and great paste deposit results
- Very good wetting on all surface finishes, including OSP
- Transparent colorless residue, even after multiple reflow cycles
COST
- Possibility of extended print-runs to minimizing machine downtime
- Flux residues can be potentially left on assembly as being non-corrosive
HSE
- No Halogen
- No CMR containing substances in flux media.
PROCESS RECOMMENDATION
The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. Be assured, our team is ready to advise and assist you in the implementation of our products.