AMTECH Solder Paste VS-213A-LF
High-Performance No-Clean Solder Paste for Precision Electronic Assembly
- Lead-free soldering
- Lead-free solder paste
- No Clean Solder Paste
AMTECH Solder Paste VS-213A-LF
Is a lead-free, no-clean solder paste specifically designed for LGA, BGA, and CSP components. With REL0 flux classification, it provides excellent wetting on all common surface finishes, low voiding, clear residue, and a long stencil life. Halogen-free per EN14582, and fully RoHS II and REACH compliant, VS-213A-LF is ideal for high-reliability, lead-free assembly applications.
| ALLOY | TEMPERATURE °C | TEMPERATURE °F |
|---|---|---|
| 42Sn/58Bi | 138 | 280 |
| 42Sn/57Bi/Ag1 | 138 | 280 |
| 96.5Sn/3.0Ag/0.5Cu | 217–220 | 423–428 |
| 99.0Sn/0.3Ag/0.7Cu | 217–221 | 423–430 |
| 96.5Sn/3.5Ag | 221 | 430 |
| 99.3Sn/0.7Cu | 227 | 441 |
| 95Sn/5Sb | 235–240 | 455–464 |
| 95Sn/5Ag | 221–245 | 430–473 |
| TEST J-STD-004 OR OTHER REQUIREMENTS (AS STATED) | TEST REQUIREMENT | RESULT |
|---|---|---|
| Copper Mirror | IPC-TM-650: 2.3.32 | L: No breakthrough |
| Corrosion | IPC-TM-650: 2.6.15 | L: No corrosion |
| Quantitative Halides | IPC-TM-650: 2.3.28.1 | L: <0.05% |
| Electrochemical Migration | IPC-TM-650: 2.6.14.1 | L: <1 decade drop (no clean) |
|
Surface Insulation Resistance 85°C, 85% RH @ 168 Hours |
IPC-TM-650: 2.6.3.7 | L: 100 M (no clean) |
| Tack Value | IPC-TM-650: 2.4.44 | 34g |
|
Viscosity – Malcom @ 10 RPM/25°C (x10³mPa/s) – SAC305 T3/T4 |
IPC-TM-650: 2.4.34.4 |
Print: 120–185 Dispensing: 105–150 |
| Visual | IPC-TM-650: 3.4.2.5 | Clear and free from precipitation |
| Conflict Minerals Compliance | Electronic Industry Citizenship Coalition (EICC) | Compliant |
| REACH Compliance | Articles 33 and 67 of regulation (EC) No 1907/2006 | Contains no substance >0.1% w/w that is listed as a SVHC or restricted for use in solder materials |
AMTECH™ solder pastes are advanced, high-performance materials engineered for precise and dependable electronic assembly. Produced in Deep River, Connecticut, USA, these solder pastes are formulated to deliver excellent printability, reliable reflow characteristics, and minimal voiding. Widely used in SMT manufacturing, AMTECH™ solder pastes provide consistent, high-quality solder joints, making them ideal for complex PCB designs and critical applications where reliability and performance matter most.
Show links
Hide linksBenefits
- Enables precise, consistent solder deposition for high-density PCB designs
- Supports automated manufacturing with excellent printability and reflow characteristics
- Enhances joint reliability for lead-free applications
- Reduces defects like bridging, voiding, and tombstoning
- Compatible with various application methods including stencil printing and dispensing
- No-clean formulations reduce the need for post-soldering cleaning, saving time and cost