AMTECH Solder Paste RMA-223-AS
High-Performance Solder Paste for Precision Electronic Assembly
- Leaded soldering
- Rosin Mildly Active Solder Paste
- Excellent Wetting Propreties
AMTECH Solder Paste RMA-223-AS
Is a leaded, rosin mildly active solder paste formulated for excellent wetting and exceptional print definition. Classified under ROM1 flux, it delivers low voiding—including under LGA components—clear residue, minimal mid-chip beading, and a long stencil life. Compatible with enclosed print heads and available in both print and dispense grades, RMA-223-AS is REACH compliant and ideal for high-precision, reliable soldering applications.
| ALLOY | TEMPERATURE °C | TEMPERATURE °F |
|---|---|---|
| 63Sn/37Pb | 183 | 361 |
| 62Sn/36Pb/2Ag | 179 | 354 |
| 62.8Sn/36.8Pb/0.4Ag | 179–183 | 354–361 |
| 60Sn/40Pb | 183–191 | 361–376 |
| 43Sn/43Pb/14Bi | 144–163 | 291–325 |
| TEST J-STD-004 OR OTHER REQUIREMENTS (AS STATED) | TEST REQUIREMENT | RESULT |
|---|---|---|
| Copper Mirror | IPC-TM-650: 2.3.32 | L: No breakthrough |
| Corrosion | IPC-TM-650: 2.6.15 | L: No corrosion |
| Quantitative Halides | IPC-TM-650: 2.3.28.1 | M: 0.5–2.0% |
| Electrochemical Migration | IPC-TM-650: 2.6.14.1 | M: <1 decade drop (cleaned) |
|
Surface Insulation Resistance 85°C, 85% RH @ 168 Hours |
IPC-TM-650: 2.6.3.7 | M: ≥100 MΩ (cleaned) |
| Tack Value | IPC-TM-650: 2.4.44 | 48g |
|
Viscosity – Malcom @ 10 RPM / 25°C (x10³ mPa/s) – Sn63/Pb37 T3/T4 |
IPC-TM-650: 2.4.34.4 |
Print: 185–255 Dispensing: 100–145 |
| Visual | IPC-TM-650: 3.4.2.5 | Clear and free from precipitation |
| Conflict Minerals Compliance | Electronic Industry Citizenship Coalition (EICC) | Compliant |
| REACH Compliance | Articles 33 and 67 of regulation (EC) No 1907/2006 | Contains no substance >0.1% w/w that is listed as a SVHC or restricted for use in solder materials |
AMTECH™ solder pastes are advanced, high-performance materials engineered for precise and dependable electronic assembly. Produced in Deep River, Connecticut, USA, these solder pastes are formulated to deliver excellent printability, reliable reflow characteristics, and minimal voiding. Widely used in SMT manufacturing, AMTECH™ solder pastes provide consistent, high-quality solder joints, making them ideal for complex PCB designs and critical applications where reliability and performance matter most.
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- Enables precise, consistent solder deposition for high-density PCB designs
- Supports automated manufacturing with excellent printability and reflow characteristics
- Enhances joint reliability for leaded applications
- Reduces defects like bridging, voiding, and tombstoning
- Compatible with various application methods including stencil printing and dispensing