AMTECH Solder Paste NC-560-LF

High-Performance Solder Paste for Precision Electronic Assembly

  • Lead-free soldering
  • Lead-free solder paste
  • Excellent Wetting Propreties

AMTECH Solder Paste NC-560-LF

Is a lead-free solder paste designed for high-speed, reliable electronic assembly. With REL0 flux classification and print definition up to 125 mm/sec, it offers excellent wetting on common finishes, including Ni/Au, along with low voiding and clear residue. NC-560-LF reduces head-in-pillow defects and matches the wetting performance of tin/lead processes. RoHS II and REACH compliant, it is available in both print and dispense grades.

AMTECH Solder Paste NC-560-LF Compatible Alloys

AMTECH Solder Paste NC-560-LF Test Results

AMTECH™ solder pastes are advanced, high-performance materials engineered for precise and dependable electronic assembly. Produced in Deep River, Connecticut, USA, these solder pastes are formulated to deliver excellent printability, reliable reflow characteristics, and minimal voiding. Widely used in SMT manufacturing, AMTECH™ solder pastes provide consistent, high-quality solder joints, making them ideal for complex PCB designs and critical applications where reliability and performance matter most.

Benefits

  • Enables precise, consistent solder deposition for high-density PCB designs/li>
  • Supports automated manufacturing with excellent printability and reflow characteristics/li>
  • Enhances joint reliability for lead-free applications/li>
  • Reduces defects like bridging, voiding, and tombstoning/li>
  • Compatible with various application methods including stencil printing and dispensing