AMTECH Solder Paste NC-560-LF
High-Performance Solder Paste for Precision Electronic Assembly
- Lead-free soldering
- Lead-free solder paste
- Excellent Wetting Propreties
AMTECH Solder Paste NC-560-LF
Is a lead-free solder paste designed for high-speed, reliable electronic assembly. With REL0 flux classification and print definition up to 125 mm/sec, it offers excellent wetting on common finishes, including Ni/Au, along with low voiding and clear residue. NC-560-LF reduces head-in-pillow defects and matches the wetting performance of tin/lead processes. RoHS II and REACH compliant, it is available in both print and dispense grades.
| ALLOY | TEMPERATURE °C | TEMPERATURE °F |
|---|---|---|
| 42Sn/58Bi | 138 | 280 |
| 42Sn/57Bi/Ag1 | 138 | 280 |
| 96.5Sn/3.0Ag/0.5Cu | 217–220 | 423–428 |
| 99.0Sn/0.3Ag/0.7Cu | 217–221 | 423–430 |
| 96.5Sn/3.5Ag | 221 | 430 |
| 99.3Sn/0.7Cu | 227 | 441 |
| 95Sn/5Sb | 235–240 | 455–464 |
| 95Sn/5Ag | 221–245 | 430–473 |
| TEST J-STD-004 OR OTHER REQUIREMENTS (AS STATED) | TEST REQUIREMENT | RESULT |
|---|---|---|
| Copper Mirror | IPC-TM-650: 2.3.32 | L: No breakthrough |
| Corrosion | IPC-TM-650: 2.6.15 | L: No corrosion |
| Quantitative Halides | IPC-TM-650: 2.3.28.1 | <0.05% |
| Electrochemical Migration | IPC-TM-650: 2.6.14.1 | L: <1 decade drop (no-clean) |
|
Surface Insulation Resistance 85°C, 85% RH @ 168 Hours |
IPC-TM-650: 2.6.3.7 | L: >100 MΩ (no-clean) |
| Tack Value | IPC-TM-650: 2.4.44 | 33g |
|
Viscosity – Malcom @ 10 RPM / 25°C (x10³ mPa/s) – SAC305 T3 / T4 |
IPC-TM-650: 2.4.34.4 |
Print: 140–195 Dispensing: 115–160 |
| Visual | IPC-TM-650: 3.4.2.5 | Clear and free from precipitation |
| Conflict Minerals Compliance | Electronic Industry Citizenship Coalition (EICC) | Compliant |
| REACH Compliance | Articles 33 and 67 of regulation (EC) No 1907/2006 | Contains no substance >0.1% w/w that is listed as a SVHC or restricted for use in solder materials |
AMTECH™ solder pastes are advanced, high-performance materials engineered for precise and dependable electronic assembly. Produced in Deep River, Connecticut, USA, these solder pastes are formulated to deliver excellent printability, reliable reflow characteristics, and minimal voiding. Widely used in SMT manufacturing, AMTECH™ solder pastes provide consistent, high-quality solder joints, making them ideal for complex PCB designs and critical applications where reliability and performance matter most.
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- Enables precise, consistent solder deposition for high-density PCB designs
- Supports automated manufacturing with excellent printability and reflow characteristics
- Enhances joint reliability for lead-free applications
- Reduces defects like bridging, voiding, and tombstoning
- Compatible with various application methods including stencil printing and dispensing