AMTECH NC-560-TF
Tacky flux for professionals
- Leaded soldering
- Excellent wetting properties
AMTECH NC-560-TF
Is a high-performance ROL0-classified flux designed for leaded and lead-free soldering. It delivers excellent wetting for reliable joints across various alloy systems, including low melting point alloys. Remaining tacky for up to 48 hours, it’s ideal for extended processes. RoHS II compliant and compatible with most board finishes, it’s perfect for rework and assembly of BGA, PGA, and CSP packages.
TEST RESULTS
| TEST J-STD-004 OR OTHER REQUIREMENTS (AS STATED) | TEST REQUIREMENT | RESULT |
|---|---|---|
| Copper Mirror | IPC-TM-650: 2.3.32 | L: No breakthrough |
| Corrosion | IPC-TM-650: 2.6.15 | L: No corrosion |
| Quantitative Halides | IPC-TM-650: 2.3.28.1 | L: <0.5% |
| Electrochemical Migration | IPC-TM-650: 2.6.14.1 | L: <1 decade drop (no clean) |
|
Surface Insulation Resistance 85°C, 85% RH @ 168 Hours |
IPC-TM-650: 2.6.3.7 | L: 100 MΩ (No-clean) |
|
Viscosity Malcom @ 10 RPM / 25°C (x10³ mPa/s) |
IPC-TM-650: 2.4.34.4 | 40–52 |
| Visual | IPC-TM-650: 3.4.2.5 | Clear and free from precipitation |
| Conflict Minerals Compliance | Electronic Industry Citizenship Coalition (EICC) | Compliant |
| REACH Compliance | Articles 33 and 67 of regulation (EC) No 1907/2006 | May contain up to 1% w/w of ethoxylated 4-nonylphenol |
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Hide linksBenefits
- ROL0 flux classification
- Can be used with low melting alloys
- Optimized for lead-free and standard alloy systems
- Will remain tacky for 48 hours
- RoHS II compliant
- Excellent wetting compatibility with most board finishes
- Ideal for rework, BGA, PGA ad CSP packages