AMTECH NC-560-LF-TF
No Clean Tacky flux for professionals
- No clean tacky flux
- Lead-Free soldering
- Excellent wetting properties
AMTECH NC-560-LF-TF
Is a no-clean, ROL0-classified tacky flux formulated for lead-free soldering with excellent wetting on all common finishes, including Ni/Au. It leaves a clear residue, reduces voiding and head-in-pillow defects, and offers wetting performance comparable to tin/lead processes. RoHS II and REACH compliant, it’s ideal for high-reliability applications, and is also available in print and dispense grade solder paste.
TEST RESULTS
| TEST J-STD-004 OR OTHER REQUIREMENTS (AS STATED) | TEST REQUIREMENT | RESULT |
|---|---|---|
| Copper Mirror | IPC-TM-650: 2.3.32 | L: No breakthrough |
| Corrosion | IPC-TM-650: 2.6.15 | L: No corrosion |
| Quantitative Halides | IPC-TM-650: 2.3.28.1 | L: <0.05% |
| Electrochemical Migration | IPC-TM-650: 2.6.14.1 | L: <1 decade drop (no clean) |
|
Surface Insulation Resistance 85°C, 85% RH @ 168 Hours |
IPC-TM-650: 2.6.3.7 | L: ≥100 MΩ (no clean) |
|
Viscosity Malcom @ 10 RPM / 25°C (x10³ mPa/s) |
IPC-TM-650: 2.4.34.4 | 20–48 |
| Visual | IPC-TM-650: 3.4.2.5 | Clear and free from precipitation |
| Conflict Minerals Compliance | Electronic Industry Citizenship Coalition (EICC) | Compliant |
| REACH Compliance | Articles 33 and 67 of regulation (EC) No 1907/2006 | Contains no substance >0.1% w/w that is listed as a SVHC or restricted for use in solder materials |
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Hide linksBenefits
- ROL0 flux classification
- Excellent wetting on all common finishes including Ni/Au
- Clear residue
- Low voiding
- Reduces head in pillow defects
- RoHS II and REACH compliant
- Comparable wetting performance to tin/lead process
- Print & dispense grae solder paste available