The ongoing trend of miniaturization in electronics and semiconductor segments makes solder paste jetting a fast-emerging manufacturing technology. Accurate solder paste deposition improves yield rates especially for 3D electronics, embedded chips, LED assemblies or high-density circuit boards utilizing (ultra)fine-pitch components.
To address these demands and push the technological limits further towards high-reliable and cost-efficient manufacturing processes, Vermes and INVENTEC have formed a technology cooperation. Both companies bring in their expertise to increase equipment speed while minimizing downtime and avoid costly rework processes caused by improper process stability.
The first milestone – the symbiosis of precision SAC305 T6 highspeed jetting solder paste together with Vermes leading jetting valve technology – is successfully achieved and commercially available. To address customer demands and expand the technological possibilities of solder paste jetting, other alloy choices and ultrafine T7 jetting paste formulations will be developed and evaluated in the near future.
About VERMES:
VERMES MICRODISPENSING in Holzkirchen is a high-tech innovator that revolutionized micro dispensing technology by introducing the world’s first contact-free piezo-based dispensing systems in 2001. With subsidiaries in China, the USA, South Korea, Malaysia, India, and Japan, Vermes is the trusted partner for automotive, consumer electronics, semiconductor, communication, medical, and pharmaceutical manufacturers.
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PRESS Vermes – Inventec – Technology cooperation