The ongoing trend of miniaturization in electronics and semiconductor segments makes solder paste jetting a fast emerging manufacturing technology. Accurate solder paste deposition improves yield rates especially for 3D electronics, embedded chips, LED assemblies or high-density circuit boards utilizing (ultra)fine-pitch components.
To address these demands and push the technological limits further towards high-reliable and cost-efficient manufacturing processes, Essemtec and INVENTEC have formed a technology cooperation. Both companies bring in their expertise to increase equipment speed while minimizing downtime and avoid costly rework processes caused by improper process stability.
The first milestone – the symbiosis of precision SAC305 T6 highspeed jetting solder paste together with Essemtec jetting equipment innovations – is successfully achieved and commercially available. To address customer demands and expand the technological possibilities of solder paste jetting, other alloy choices and ultrafine T7 jetting paste formulations will be developed and evaluated in the near future.
About ESSEMTEC:
At Essemtec, we design and build adaptive SMT, dispensing, and software solutions that empower electronics manufacturers to produce smarter, faster, and more sustainably. We combine precision engineering with intelligent control software to deliver fully integrated All-in-One platforms for pick-and-place, high-performance jetting, advanced dispensing, and reflow — all within a single, modular ecosystem.
Supported by a global network of sales and service specialists, Essemtec empowers electronics manufacturers worldwide to build smarter, faster, and more efficiently.
Our Focus – Your Solution.
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