AMTECH Solder Paste NC-559-V2
High-Performance No-Clean Solder Paste for Precision Electronic Assembly
- Leaded soldering
- Lead solder paste
- No Clean Solder Paste
AMTECH Solder Paste NC-559-V2
Is a high-performance, no-clean solder paste with a REL0 flux classification, designed for fast, precise electronic assembly. It delivers exceptional print definition at speeds up to 100 mm/sec, with a long stencil life and wide process window for maximum production flexibility. NC-559-V2 ensures low voiding, clear residue, and excellent wetting on most board finishes and is available in both print and dispense grades to suit various manufacturing needs.
AMTECH™ solder pastes are advanced, high-performance materials engineered for precise and dependable electronic assembly. Produced in Deep River, Connecticut, USA, these solder pastes are formulated to deliver excellent printability, reliable reflow characteristics, and minimal voiding. Widely used in SMT manufacturing, AMTECH™ solder pastes provide consistent, high-quality solder joints, making them ideal for complex PCB designs and critical applications where reliability and performance matter most.
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- Enables precise, consistent solder deposition for high-density PCB designs/li>
- Supports automated manufacturing with excellent printability and reflow characteristics/li>
- Enhances joint reliability for leaded applications/li>
- Reduces defects like bridging, voiding, and tombstoning/li>
- Compatible with various application methods including stencil printing and dispensing
- No-clean formulations reduce the need for post-soldering cleaning, saving time and cost