Ecorel™ Free LT140-18

  • Sn42Bi57.6Ag0.4 lead free solder paste
  • Low temperature SMT printing process
  • Halogen free & low voiding

ECOREL™ FREE LT 140-18 is a no clean solder paste combining the metallurgical properties and benefits of a low melting point alloy with high performance chemistry of the ECOREL™ range, assuring that the assembled electronics can reach their best reliability. A low reflow temperature is recommended for thermal sensitive components such as LEDs, MEMS, CMOS, plastics and flexible circuits.

Compared to low melting point alloy solder pastes like SnBi, ECOREL™ FREE LT 140-18 achieves better wetting and solder joint strength due to the presence of silver.

Benefits

PERFORMANCE

  • Excellent solder joint strenght and interconnection reliability
  • Superior Wettability – reduced solderballing
  • Low voiding

COST

  • Reduced energy consumption

HSE

  • Reduced CO2 emissions
  • Halogen free

Process Recommendation

The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. Be assured, our team is ready to advise and assist you in the implementation of our products.