Excelente impresi\u00f3n y alta viscosidad<\/li>\n<\/ul>\nECOFREC TF48<\/h5>\n
Es un fundente pegajoso sin hal\u00f3genos, dise\u00f1ado para aplicaciones sin plomo y con plomo. Despu\u00e9s del reflujo, el residuo no es corrosivo. La mejor en su clase para dispensar, sumergir y especialmente para aplicaciones de impresi\u00f3n.<\/p>\n
ECOFREC TF48<\/strong> se puede aplicar por puntos con una jeringa, por inmersi\u00f3n, con un pincel o por serigraf\u00eda utilizando una plantilla.<\/p>\nDespu\u00e9s de la aplicaci\u00f3n, ECOFREC TF48<\/strong> presenta un buen poder adhesivo y permite mantener los componentes en su lugar hasta el momento de la refusi\u00f3n de la aleaci\u00f3n utilizando una estaci\u00f3n de reparaci\u00f3n por aire caliente, un horno de infrarrojos o por convecci\u00f3n, o bien mediante una estaci\u00f3n de fase de vapor o un soldador.<\/p>\n<\/p>\n
\n PROPIEDADES\n<\/div>\n
\n\n| \n ESPECIFICACIONES\n <\/th>\n | \n ECOFREC TF48\n <\/th>\n<\/tr>\n |
\n| \n Aspecto del flux\n <\/td>\n | \n \u00c1mbar\n <\/td>\n<\/tr>\n |
\n| \n Densidad a 20\u00b0C (g\/cm\u00b3)\n <\/td>\n | \n 1\n <\/td>\n<\/tr>\n |
\n| \n Solubilidad en agua\n <\/td>\n | \n Insoluble\n <\/td>\n<\/tr>\n |
\n| \n Solubilidad en alcohol\n <\/td>\n | \n Soluble\n <\/td>\n<\/tr>\n |
\n| \n Hal\u00f3geno\n <\/td>\n | \n Sin hal\u00f3genos\n <\/td>\n<\/tr>\n |
\n\n Viscosidad (Pa\u00b7s a 20\u00b0C)
\n (Brookfield RVT TF a 5 RPM)\n <\/td>\n | \n 350 \u2013 550\n <\/td>\n<\/tr>\n<\/table>\n <\/p>\n \n CARACTER\u00cdSTICAS\n<\/div>\n \n\n| \n ENSAYOS EST\u00c1NDAR\n <\/th>\n | \n RESULTADOS\n <\/th>\n | \n PROCEDIMIENTOS\n <\/th>\n<\/tr>\n | \n| \n Clasificaci\u00f3n del flux\n <\/td>\n | \n ROL0\n <\/td>\n | \n ANSI\/J-STD-004\n <\/td>\n<\/tr>\n | \n\n Resistencia de aislamiento superficial \/
\n Electromigraci\u00f3n (IPC)\n <\/td>\n | \n Aprobado\n <\/td>\n | \n ANSI\/J-STD-004\n <\/td>\n<\/tr>\n | \n\n Ensayo BONO
\n 85\u00b0C \/ 85% HR \u2013 15 d\u00edas\n <\/td>\n | \n Aprobado: Fc < 1%\n <\/td>\n | \n Inventec MO.SB.10029\n <\/td>\n<\/tr>\n | \n| \n Papel cromato\n <\/td>\n | \n Aprobado\n <\/td>\n | \n ANSI\/J-STD-004\n <\/td>\n<\/tr>\n | \n| \n Espejo de cobre\n <\/td>\n | \n Aprobado\n <\/td>\n | \n ANSI\/J-STD-004\n <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"\n- No hay flujo pegajoso limpio<\/li>\n
- Flip Chip, soldadura de esferas y retrabajo de componentes<\/li>\n
- Excelente impresi\u00f3n y alta viscosidad<\/li>\n<\/ul>\n","protected":false},"featured_media":4020,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"inline_featured_image":false},"product_brand":[],"product_cat":[2883,2885,2887,2891],"product_tag":[4612,5391,4636,4640,4003,5379,5032,1474,5383,4004,5373,5399,1463,5347,5403,5307,4005,5387,5211,5231,1475,4006,5395],"class_list":{"0":"post-9933","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-soluciones-de-fundente-adhesivo","7":"product_cat-proceso-de-union-de-esferas-para-encapsulado-de-semiconductores","8":"product_cat-proceso-flip-chip-y-csp-para-encapsulado-de-semiconductores","9":"product_cat-soluciones-de-fundente-para-reparacion","10":"product_tag-a-base-de-disolvente","11":"product_tag-alta-viscosidad","12":"product_tag-aplicar-con-pincel","13":"product_tag-aplicar-por-inmersion","14":"product_tag-ball-attach-es","15":"product_tag-bola-de-soldadura","16":"product_tag-dispensado","17":"product_tag-ecofrec-tf48-es","18":"product_tag-esfera","19":"product_tag-flip-chip-es","20":"product_tag-fundente-adhesivo","21":"product_tag-impresion-por-estencil","22":"product_tag-pop-es","23":"product_tag-retrabajo","24":"product_tag-retrabajo-de-componentes","25":"product_tag-sin-limpieza","26":"product_tag-smt-es","27":"product_tag-soldadura-por-esferas","28":"product_tag-soldadura-smt-es","29":"product_tag-soldadura-tht-es","30":"product_tag-tf48-es","31":"product_tag-tht-es","32":"product_tag-viscosidad","33":"pa_application-ball-attach-es","34":"pa_application-flip-chip-es","35":"pa_application-pop-es","36":"pa_application-soldadura-smt-tht","37":"pa_brand-ecofrec-es-2","38":"pa_features-a-base-de-disolvente","39":"pa_processes-aplicacion-con-brocha","40":"pa_processes-aplicacion-por-inmersion","41":"pa_processes-dispensacion","42":"pa_processes-impresion","43":"pa_product-category-fundente-pegajoso","45":"first","46":"instock","47":"shipping-taxable","48":"product-type-simple"},"acf":[],"_links":{"self":[{"href":"https:\/\/www.inventec.dehon.com\/es\/wp-json\/wp\/v2\/product\/9933","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.inventec.dehon.com\/es\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.inventec.dehon.com\/es\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.inventec.dehon.com\/es\/wp-json\/wp\/v2\/comments?post=9933"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.inventec.dehon.com\/es\/wp-json\/wp\/v2\/media\/4020"}],"wp:attachment":[{"href":"https:\/\/www.inventec.dehon.com\/es\/wp-json\/wp\/v2\/media?parent=9933"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.inventec.dehon.com\/es\/wp-json\/wp\/v2\/product_brand?post=9933"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.inventec.dehon.com\/es\/wp-json\/wp\/v2\/product_cat?post=9933"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.inventec.dehon.com\/es\/wp-json\/wp\/v2\/product_tag?post=9933"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}
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![\"ECOFREC](\"https:\/\/www.inventec.dehon.com\/wp-content\/uploads\/2021\/06\/Ecofrec-syringe-tacky-flux-1-600x600.png\")
<\/p>\n