{"id":9915,"date":"2021-06-16T14:37:13","date_gmt":"2021-06-16T14:37:13","guid":{"rendered":"https:\/\/www.inventec.dehon.com\/product\/ecofrec-pop-ws30\/"},"modified":"2026-03-16T14:50:41","modified_gmt":"2026-03-16T13:50:41","slug":"ecofrec-pop-ws30","status":"publish","type":"product","link":"https:\/\/www.inventec.dehon.com\/es\/product\/ecofrec-pop-ws30\/","title":{"rendered":"ECOFREC POP WS30"},"content":{"rendered":"<p><img decoding=\"async\" src=\"https:\/\/www.inventec.dehon.com\/wp-content\/uploads\/2021\/06\/Ecofrec-syringe-tacky-flux-1-600x600.png\" alt=\"ECOFREC POP WS30\" class=\"responsive-img\" align=\"right\" style=\"border-radius:10px; margin-bottom:10px; margin-top:-10px; margin-left:15px; width:300px\" \/><\/p>\n<h2 style=\"color:#9bc947; margin-bottom:15px\">Flux adhesivo a base de agua<\/h2>\n<ul>\n<li>Fundente pegajoso soluble en agua<\/li>\n<li>Proceso PoP y Flip Chip<\/li>\n<li>Excelentes propiedades de humectaci\u00f3n<\/li>\n<\/ul>\n<h5>ECOFREC POP WS30<\/h5>\n<p>Es un fundente pegajoso soluble en agua dise\u00f1ado para el proceso de Paquete sobre Paquete y el proceso de Flip Chip. Es adecuado para la soldadura sin plomo y con plomo, con o sin nitr\u00f3geno. <\/p>\n<p>La reolog\u00eda y la adhesividad de <strong>ECOFREC POP WS30<\/strong> est\u00e1n optimizadas para mantener los envases en su sitio antes y durante el reflujo. La limpieza de la placa de circuito impreso es necesaria despu\u00e9s de la soldadura con un proceso a base de agua.<\/p>\n<p><!-- FEATURES Section --><\/p>\n<div style=\"font-weight:bold; border-bottom:2px solid #9DBB2F; padding-bottom:6px; margin-bottom:10px;\">\n  CARACTER\u00cdSTICAS\n<\/div>\n<table width=\"100%\" cellpadding=\"0\" cellspacing=\"0\" style=\"border-collapse:collapse; width:100%; max-width:100%;\">\n<tr>\n<th align=\"left\" style=\"background:#7A7A7A; color:#fff; padding:8px 12px; border:1px solid #BDBDBD;\">ESPECIFICACIONES<\/th>\n<th align=\"left\" style=\"background:#7A7A7A; color:#fff; padding:8px 12px; border:1px solid #BDBDBD;\">ECOFREC POP WS30<\/th>\n<\/tr>\n<tr>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">Aspecto<\/td>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">Amarillo claro<\/td>\n<\/tr>\n<tr style=\"background:#E6E6E6;\">\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">Solubilidad en agua<\/td>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">Soluble<\/td>\n<\/tr>\n<tr>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">Solubilidad en alcohol<\/td>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">Soluble<\/td>\n<\/tr>\n<tr style=\"background:#E6E6E6;\">\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">Densidad a 20\u00b0C<\/td>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">1,0<\/td>\n<\/tr>\n<tr>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">Contenido de hal\u00f3genos<\/td>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">Sin hal\u00f3genos<\/td>\n<\/tr>\n<tr style=\"background:#E6E6E6;\">\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">Viscosidad (Pa.s a 25\u00b0C)<br \/>Re\u00f3metro Thermoscientific*<\/td>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">20<\/td>\n<\/tr>\n<\/table>\n<p style=\"font-size:12px;\">*El equipo utilizado es de placa\/plata m\u00f3vil con di\u00e1metro de 35 mm<\/p>\n<p><!-- CHARACTERISTICS Section --><\/p>\n<div style=\"font-weight:bold; border-bottom:2px solid #9DBB2F; padding-bottom:6px; margin:30px 0 10px 0;\">\n  CARACTER\u00cdSTICAS\n<\/div>\n<table width=\"100%\" cellpadding=\"0\" cellspacing=\"0\" style=\"border-collapse:collapse; width:100%; max-width:100%;\">\n<tr>\n<th align=\"left\" style=\"background:#7A7A7A; color:#fff; padding:8px 12px; border:1px solid #BDBDBD;\">CARACTER\u00cdSTICAS<\/th>\n<th align=\"left\" style=\"background:#7A7A7A; color:#fff; padding:8px 12px; border:1px solid #BDBDBD;\">VALORES<\/th>\n<th align=\"left\" style=\"background:#7A7A7A; color:#fff; padding:8px 12px; border:1px solid #BDBDBD;\">M\u00c9TODO<\/th>\n<\/tr>\n<tr>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">Clasificaci\u00f3n del flux<\/td>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">REH1 \/ 122<\/td>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">ANSI\/J-STD-004 \/ ISO 9454<\/td>\n<\/tr>\n<tr style=\"background:#E6E6E6;\">\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">Prueba de formaci\u00f3n de bolas de soldadura<\/td>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">Aprobado<\/td>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">ANSI\/J-STD-005<\/td>\n<\/tr>\n<tr>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">Espejo de cobre<\/td>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">H Aprobado<\/td>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">ANSI\/J-STD-004<\/td>\n<\/tr>\n<tr style=\"background:#E6E6E6;\">\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">Corrosi\u00f3n de cobre mayor<\/td>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">Aprobado<\/td>\n<td style=\"padding:8px 12px; border:1px solid #BDBDBD;\">ANSI\/J-STD-004<\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<ul>\n<li>Fundente adhesivo soluble en agua<\/li>\n<li>Proceso PoP y Flip Chip<\/li>\n<li>Excelentes propiedades de humectaci\u00f3n<\/li>\n<\/ul>\n<p><a href=\"https:\/\/www.inventec.dehon.com\/wp-content\/uploads\/2023\/07\/GW-Score-47.png\"><img decoding=\"async\" class=\"alignleft size-full wp-image-15530\" src=\"https:\/\/www.inventec.dehon.com\/wp-content\/uploads\/2023\/07\/GW-Score-47.png\" alt=\"\" width=\"278\" height=\"236\" \/><\/a><\/p>\n","protected":false},"featured_media":4020,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"inline_featured_image":false},"product_brand":[],"product_cat":[2883,2888,2887],"product_tag":[5255,1462,5036,4004,5373,5327,5096,1463,5084,1464],"class_list":{"0":"post-9915","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-soluciones-de-fundente-adhesivo","7":"product_cat-proceso-de-ensamblaje-pop-para-encapsulado-de-semiconductores","8":"product_cat-proceso-flip-chip-y-csp-para-encapsulado-de-semiconductores","9":"product_tag-a-base-de-agua-es","10":"product_tag-ecofrec-pop-ws30-es","11":"product_tag-excelente-mojabilidad","12":"product_tag-flip-chip-es","13":"product_tag-fundente-adhesivo","14":"product_tag-nitrogeno","15":"product_tag-plomo","16":"product_tag-pop-es","17":"product_tag-sin-plomo","18":"product_tag-ws30-es","19":"pa_application-flip-chip-es","20":"pa_application-pop-es","21":"pa_brand-ecofrec-es-2","22":"pa_features-a-base-de-agua","23":"pa_product-category-fundente-pegajoso","25":"first","26":"instock","27":"shipping-taxable","28":"product-type-simple"},"acf":[],"_links":{"self":[{"href":"https:\/\/www.inventec.dehon.com\/es\/wp-json\/wp\/v2\/product\/9915","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.inventec.dehon.com\/es\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.inventec.dehon.com\/es\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.inventec.dehon.com\/es\/wp-json\/wp\/v2\/comments?post=9915"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.inventec.dehon.com\/es\/wp-json\/wp\/v2\/media\/4020"}],"wp:attachment":[{"href":"https:\/\/www.inventec.dehon.com\/es\/wp-json\/wp\/v2\/media?parent=9915"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.inventec.dehon.com\/es\/wp-json\/wp\/v2\/product_brand?post=9915"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.inventec.dehon.com\/es\/wp-json\/wp\/v2\/product_cat?post=9915"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.inventec.dehon.com\/es\/wp-json\/wp\/v2\/product_tag?post=9915"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}