Ecofrec™ 200

Ecofrec™ 200

Low residue no-clean air or nitrogen atmosphere


ECOFREC™ 200 is an alcohol based low-residue no clean flux recommended for soldering either with air or nitrogen controlled atmosphere. Good solder joints without solderballing are achieved with this low residue flux.

  • No microballing
  • Compatible with different PCB lead-free finishing as Ni/Au, Sn, Ag, HAL and OSP, even after prior heat cycle
  • Compatible with a wide range of solder mask
  • Possible to use with leaded and lead-free product

  Download the product sheet