ECOREL™ FREE 105-16 is a No Clean solder paste combining the metallurgical properties and cost benefits of a low silver alloy with high performance chemistry of the ECOREL™ range assuring a robust assembly process for high volume electronics

  • Very Low solder void percentage
  • Excellent visual solder joint cosmetics/ transparent residues even after multiple reflow cycles
  • High first pass yield testability in ICT
  • Very good wetting in different board finishes including OSP.

Compared to no-silver alloy solder pastes like SnCu0.7, ECOREL™ FREE 105-16 exhibits better wetting due to the presence of silver, and a higher reliability, tensile strength and creep characteristics improvements due to the addition of nickel.

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