ECOREL™ Free 007-21

FEATURES

ECOREL™ FREE 007-21 is part of our second generation of No Clean solder paste combining the metallurgical properties and cost benefits of SnCu alloy - an eutectic leadfree alloy - with high performance chemistry of the ECOREL™ range assuring that the assembled electronics can reach their best reliability, while exposed to tough conditions of humidity and temperature.

· The flux residues remaining on the PCB after soldering are chemically inert. It passes the Bono corrosion test. This is a key attribute to control the risk for electrochemical migration

· Multiple reflow cycles without graping even on very small deposits.

· Low solder void percentage

  Documentation