ECOREL™ Free 007-16

FEATURES

ECOREL™ FREE 007-16 is part of our second generation of No Clean solder paste combining the metallurgical properties and cost benefits of SnCu alloy - an eutectic leadfree alloy - with high performance chemistry of the ECOREL™ range assuring a robust assembly process for high volume electronics

· Very Low solder void percentage

· Excellent visual solder joint cosmetics/ transparent residues even after multiple reflow cycles

· High first pass yield testability in ICT

· Very good wetting in different board finishes including OSP

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  Documentation