ECOREL™ Free 007-16
FEATURES
ECOREL™ FREE 007-16 is part of our second generation of No Clean solder paste combining the metallurgical properties and cost benefits of SnCu alloy - an eutectic leadfree alloy - with high performance chemistry of the ECOREL™ range assuring a robust assembly process for high volume electronics
· Very Low solder void percentage
· Excellent visual solder joint cosmetics/ transparent residues even after multiple reflow cycles
· High first pass yield testability in ICT
· Very good wetting in different board finishes including OSP