ECOREL™ Free 007-16 T4


ECOREL™ FREE 007-16 T4 is part of our second generation of No Clean solder paste combining the metallurgical properties and cost benefits of SnCu alloy - an eutectic leadfree alloy - with high performance chemistry of the ECOREL™ range assuring a robust assembly process for high volume electronics.

The fine particle size distribution of its type 4 powder enhances the printing quality for small apertures.

  • Excellent visual solder joint cosmetics/ transparent residues even after multiple reflow cycles
  • High first pass yield testability in ICT
  • Very good wetting in different board finishes including OSP
  • Very Low solder void percentage

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