ECOREL™ Free 007-16 T4
FEATURES
ECOREL™ FREE 007-16 T4 is part of our second generation of No Clean solder paste combining the metallurgical properties and cost benefits of SnCu alloy - an eutectic leadfree alloy - with high performance chemistry of the ECOREL™ range assuring a robust assembly process for high volume electronics.
The fine particle size distribution of its type 4 powder enhances the printing quality for small apertures.
- Excellent visual solder joint cosmetics/ transparent residues even after multiple reflow cycles
- High first pass yield testability in ICT
- Very good wetting in different board finishes including OSP
- Very Low solder void percentage