{"id":606,"count":0,"description":"Speziell entwickelte L\u00f6tl\u00f6sungen f\u00fcr Halbleiterprozesse wie Die Attach, Ball Attach (CSP, BGA), Flip Chip und Waferbumping, POP &amp; SIP.\r\n\r\n<a href=\"https:\/\/www.inventec.dehon.com\/wp-content\/uploads\/2025\/06\/BRO-Electronic-DE.pdf\" class=\"inv-btn btn btn-primary btn-lg rounded-pill btn-download\" target=\"_blank\"><span><\/span>Brosch\u00fcre herunterladen<\/a>","link":"https:\/\/www.inventec.dehon.com\/de\/solutions\/loten\/halbleiter-losungen\/","name":"Halbleiter-L\u00f6sungen","slug":"halbleiter-losungen","taxonomy":"product_cat","parent":864,"meta":[],"menu_order":75,"acf":[],"_links":{"self":[{"href":"https:\/\/www.inventec.dehon.com\/de\/wp-json\/wp\/v2\/product_cat\/606","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.inventec.dehon.com\/de\/wp-json\/wp\/v2\/product_cat"}],"about":[{"href":"https:\/\/www.inventec.dehon.com\/de\/wp-json\/wp\/v2\/taxonomies\/product_cat"}],"up":[{"embeddable":true,"href":"https:\/\/www.inventec.dehon.com\/de\/wp-json\/wp\/v2\/product_cat\/864"}],"wp:post_type":[{"href":"https:\/\/www.inventec.dehon.com\/de\/wp-json\/wp\/v2\/product?product_cat=606"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}