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Electronic assembly
- CMS soldering
- Wave soldering
- CMS bonding
- Repair
- Semi-conductor Assembly
- Conformal coating
- Cleaning
- Solar assembly
Repair
Inventec has developed a wide and complete range of reliable, sustainable and long lasting chemical products for reparation and maintenance of circuit board key components such as those of BGA and QFN. There are pastes, liquid tacky flux, solder pastes and cleaning agents. They offer excellent features when taking of the component, cleaning, reballing or welding it.
9 results for Repair
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Ecofrec™ 200
ECOFREC™ 200 is a no clean flux recommended for soldering either with air or nitrogen controlled atmosphere. Good solder joints without solderballing are achieved with this low residue flux. ECOFRECTM 200 is compatible with a wide range of solder mask.
See the product sheet -
Ecofrec™ 680
ECOFREC™ 680 is a water soluble tacky flux designed for attaching Pb-Free spheres to BGAs or CSPs, rework and soldering of traditional components and SMDs on PCBs.
See the product sheet -
Ecofrec™ DD6
ECOFREC™ DD6 is a low residue, rosin flux with halogen-free organic activators. After soldering, flux residues left on the PCB are non aggressive and not liable to cause corrosion.
See the product sheet -
Ecofrec™ TF 48
ECOFREC™ TF48 is a tacky flux paste designed for soldering and rework of traditional components and SMDs. ECOFREC™ TF48 is particularly efficient for lead and lead-free components balling using spheres interconnection and for BGA repair.
See the product sheet -
Ecofrec™ TF 49
ECOFREC™ TF49 is particularly efficient for lead and lead free ball attach and BGA repair. After reflow, the residue is clear and colorless.
See the product sheet -
Ecofrec™ TF37 - 37 I
ECOFREC™ TF37 & ECOFREC™ TF37I are tacky flux pastes designed for soldering and rework of traditional components and SMDs.
See the product sheet -
Ecofrec™ TF40
ECOFREC™TF40 is a tacky flux paste designed for rework and soldering of traditional components and SMDs. ECOFREC™ TF40 is particularly efficient for BGA repairing and the balling of components using balls interconnection.
See the product sheet -
Ecorel™ Free 305-1-85 405-1-85
ECOREL™ FREE 305-1-85/405-1-85 is a lead free paste constituted with tin-silver-copper with respectively 3 or 4 % of silver. Its rheology is adapted to automatic, endless screw or direct pressure, dispensing by dots systems and is also suitable for pumprint process.
See the product sheet -
Ecorel™ Free 532 - 85
ECOREL™ FREE 532-85 is a LEAD FREE high melting point SnAg solder paste for automatic dispensing system. ECOREL™ FREE 532-85 offers an excellent wetting in a large process window. Residues are perfectly removed with all solvent or detergent cleaning sol
See the product sheet