Electronic assembly

 

Since 1973, the Inventec Electronic BU has been specialized in developing, manufacturing and commercializing products for soldering, cleaning and coating in electronics for automotive, aeronautics, military or telecoms applications, etc.laborantins

  Solder pastes and solder flux ensure, after deoxynating, the mechanical and electrical bond between electronic components and printed circuit boards. For some industries, with large production series, solder products have to be robust enough to keep up with the processing pace in production lines.
These formulations are at the crossroad of various sciences: Rheology, Chemistry, and Metallurgy. 

 

 Some application examples

• In the automotive field, several electronic equipments located under the hood and subject to severe thermal shocks, monitor the car functions.
The Electronic BU developed a solder paste which guarantees an excellent electronic, chemical and mechanical reliability for solder joints. Moreover this paste is formulated to match the high pace of automotive assembly lines.

• In aeronautics, the printed circuit boards have to be totally free of residue to avoid any low pressure degasing. The residues of the solder paste manufactured and commercialized by the electronic BU are totally eliminated with a compatible cleaner.

The Electronic BU product qualifications by our customers central laboratories and workshops requires various tests and can last up to two years.
The Electronic BU formulated products go beyond the technical performances required by our customers. They also go beyond environmental and legal laws:
ROHS (lead ban), VOC, Reach, and thus contribute to High Tech Industries sustainable development.

One of our brand: Ecofrec™ TF 48

Ecofrec™ is an adhesive flux which doesn't require any cleaning. After soldering, the remaining flux residues on printed circuit boards are not aggressive and do not present any corrosion risk.
In such a condition, no cleaning is required.