10 results for Wave soldering

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  Diluent N° 1

  DILUENT N° 1 is an alcoholic blend intended to adjust the density of soldering fluxes which have become concentrated due to evaporation during use.

  See the product sheet
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  Ecofrec™ 200

  ECOFREC^™ 200 is a no clean flux recommended for soldering either with air or nitrogen controlled atmosphere. Good solder joints without solderballing are achieved with this low residue flux. ECOFRECTM 200 is compatible with a wide range of solder mask.

  See the product sheet
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  Ecofrec™ 202

  ECOFREC™ 202 is a very low dry extract flux which can be used for lead free soldering, by foam or by spray. It has been developed to have a good wettability on different PCB lead free finish as OSP, Ni/Au, Sn, Ag.

  See the product sheet
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  Ecofrec™ 209

  ECOFREC™ 209 is an alcohol-based, halogen-free, rosin/resin-free flux. It has been developed for the standard SMT process, wave soldering and for dipping.

  See the product sheet
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  Ecofrec™ 303

  ECOFREC™ 303 is a low residue, no-clean, VOC free flux, with excellent soldering performance on any finish. This flux is recommended for lead free soldering with alloys such as SAC, SnCu, etc…, as well as those containing lead.

  See the product sheet
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  Ecofrec™ 405

  ECOFREC™ 405 is a low VOC, halogen-free, rosin/resin-free wave solder flux.  It provides excellent soldering in lead-free and in leaded wave applications. It allows excellent through-hole wetting.

  See the product sheet
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  Ecofrec™ CMA 155

  ECOFREC™ CMA 155 is a halogeneted rosin flux that presents a very good wetting and a high aptitude for cleaning with solvent or detergent.

  See the product sheet
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  Ecofrec™ DD6

  ECOFREC™ DD6 is a low residue, rosin flux with halogen-free organic activators. After soldering, flux residues left on the PCB are non aggressive and not liable to cause corrosion.

  See the product sheet
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  Ecofrec™ VLR 129

  FEATURES ECOFREC™ VLR 129 is a very low dry extract flux which can be used by foam or by spray. It has been developed to have an excellent wettability on different PCB finishes system as OSP, Ni/Au, HASL… Low odour.

  See the product sheet
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  Inertec™ 200

  INERTEC™ 200 is a no clean flux recommended for soldering either with air or nitrogen controlled atmosphere. Good solder joints without solderballing are achieved with this low residue flux. INERTEC™ 200 is compatible with a wide range of solder masks.

  See the product sheet