PERFORMANCES

In industry, SAC (SnAgCu) alloys are more used than any other lead free alloys. Many studies demonstrate no significant statistical differences SAC alloys with 3 to 4% silver content and 0,5 to 0,7% copper content ( re IPC SVPC reliability study).

In spite of the higher melting temperatures and their longer reflow profiles, ECOREL^TM FREE solder pastes have equivalent features to the best no-clean SnPb solder pastes, preferable for the majority of the industries.

The radar chart below shows the excellent printing capabilities of ECOREL^TM FREE 305-6 :

High speed printing – excellent abandon time – long, steady tackiness.

Moreover, ECOREL^TM FREE 305-6 demonstrates   good wetting properties and excellent ability to avoid solder beading.