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Electronic assembly
Ecorel™ Free 305-1-85 405-1-85
PERFORMANCES
ECOREL™ FREE 305-1-85/405-1-85 is a lead free paste constituted with tin-silver-copper with respectively 3 or 4 % of silver. Its rheology is adapted to automatic, endless screw or direct pressure, dispensing by dots systems. This solder paste offers a high dispensing stability during application.
ECOREL™ FREE 305-1-85/405-1-85 is also suitable for pumprint process.