Ecofrec™ PoP 50

ECOFREC^{^™} PoP 50 is a tacky flux designed for a Package on Package process: pre-assembly of stacked BGA packages prior to reflow. It is suitable for lead-free and leaded soldering, with or without nitrogen.

ECOFREC^{^™} PoP 50 can be applied by dipping or dispensing. Both methods allow for reproducible volumes of flux to be applies to the solder spheres.

ECOFREC^™ PoP 50’s solderability is excellent with all finishes: Cu-OSP, NiAu, Immersion Sn and Ag.

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