Electronic assembly > CMS soldering

Electronic assembly

CMS soldering

Inventec has been developing, since more than 25 years, solder pastes which meet the production caracteristics and reliability requests of its customers.

With its references in industrial High Tech markets, in the automotive, military, aeronautics fields, Inventec proposes a wide and complete range of solder pastes with metallurgic, physical and chemical features.

16 results for CMS soldering

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Ecofrec™ PoP 50

ECOFREC^™ PoP 50 is a tacky flux designed for a Package on Package process: pre-assembly of stacked BGA packages prior to reflow. It is suitable for lead-free and leaded soldering, with or without nitrogen.

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Ecorel Free HT 235-6

With its 235-240°C melting range, Sn95Sb5 alloy is a solution for high temperature reflow process. ECOREL™ FREE HT 235-6 has excellent printing capabilities : high speed printing, excellent abandon time, long steady tackiness.

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Ecorel™ Easy 802 M2 - 803 M2

ECOREL™ EASY 802M2 - 803M2 range offers a good balance between wettability, printing capability and ability to withstand various thermal profiles. ECOREL™ EASY 802M2 - 803M2 range exhibits high printing speed, excellent abandon time and long steady tackiness.

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Ecorel™ Easy 802S - 803S

ECOREL™ EASY 802 S / 803 S no-clean solder pastes have been developed for fine pitch printing. Applied by squeegees or closed head, the deposit has a very sharp definition even after several hours abandon time on stencil.

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Ecorel™ Easy 862/863

ECOREL^™ EASY 862 and 863 solder pastes are very easy to use. They exhibit very high printing capability long abandon time, steady tackiness during several days and permits a very high yield after reflow.

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Ecorel™ Free 305-1-85 405-1-85

ECOREL™ FREE 305-1-85/405-1-85 is a lead free paste constituted with tin-silver-copper with respectively 3 or 4 % of silver. Its rheology is adapted to automatic, endless screw or direct pressure, dispensing by dots systems and is also suitable for pumprint process.

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Ecorel™ Free 305-6/405-6

SAC (SnAgCu) alloys are currently the industry choice because they have excellent soldering and mechanical properties. Of these alloys, the SAC 305 (SnAg3.0Cu0.5) is preferred because several evaluations (such as IPC SPVC reliability study) have demonstrated...

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Ecorel™ Free 305-6D - Ecorel Free 387-6D

ECOREL™ FREE 305-6D and ECOREL™ FREE 387-6D have been developed to address the diverse and complex requirements of the military industry.

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Ecorel™ Free 305-6D33

ECOREL™ FREE 305-6D33 has been developed to address the diverse and complex requirements of the military, transport and energy industries. - No clean solder paste with chemically inert residue after reflow,

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Ecorel™ Free 305-7/405-7

ECOREL™ FREE 305-7/ECOREL™ FREE 405-7 have been developed to answer new production demands for a flexible paste able to be used in no-clean processes as well as those that require cleaning.

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