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Electronic assembly
Ecorel™ Free PoP 10
PERFORMANCES
Package on Package (PoP) assembly was developed as an alternative to stacking CSP’s (SCSP’s).
PoP allows die to be stacked from different suppliers and from mixed device technologies.
ECORELTM FREE PoP 10 is a solder paste which can act as a metallic bridge between the ball and the pad, reducing warpage which is the main issue for PoP assembly when tacky flux is used.
ECORELTM FREE PoP 10 is usually applied by a dipping process that delivers reproducible volumes of material onto the spheres. It can also be applied by dispensing.