7 results for Semi-conductor Assembly

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  Ecofrec™ 680

  ECOFREC™ 680 is a water soluble tacky flux designed for attaching Pb-Free spheres to BGAs or CSPs, rework and soldering of traditional components and SMDs on PCBs.

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  Ecofrec™ PoP 50

  ECOFREC^™ PoP 50 is a tacky flux designed for a Package on Package process: pre-assembly of stacked BGA packages prior to reflow. It is suitable for lead-free and leaded soldering, with or without nitrogen.

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  Ecofrec™ TF 49

  ECOFREC™ TF49 is particularly efficient for lead and lead free ball attach and BGA repair. After reflow, the residue is clear and colorless.

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  Ecorel™ Easy 802 M2 - 803 M2

  ECOREL™ EASY 802M2 - 803M2 range offers a good balance between wettability, printing capability and ability to withstand various thermal profiles. ECOREL™ EASY 802M2 - 803M2 range exhibits high printing speed, excellent abandon time and long steady tackiness.

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  Ecorel™ Easy 802S - 803S

  ECOREL™ EASY 802 S / 803 S no-clean solder pastes have been developed for fine pitch printing. Applied by squeegees or closed head, the deposit has a very sharp definition even after several hours abandon time on stencil.

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  Ecorel™ Free 305-7/405-7

  ECOREL™ FREE 305-7/ECOREL™ FREE 405-7 have been developed to answer new production demands for a flexible paste able to be used in no-clean processes as well as those that require cleaning.

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  Ecorel™ Free PoP 10

  Package on Package (PoP) assembly has been developed as an alternative to stacking CSP’s (SCSP’s).

  See the product sheet